Buff and Shine and SHINE 300Y Backing Pad, 3 in Dia, 1/2 in THK, Hook and Loop Attachment Type kda3000.q01 A domed design allows up

A domed design allows up to 3 oz of fluid below the filter

and stock removal

XPSAP can also be used over our urethane repair material (XSMAP

pressure sensitive adhesive allow easy application and removal

The MPN for 3M Products MMM is 26122

Buff and Shine and SHINE 300Y Backing Pad, 3 in Dia, 1/2 in THK, Hook and Loop Attachment Type kda3000.q01 A domed design allows upOur re engineered high quality backing plates for high speed buffing were developed with our 20 years of past expertise in the field. These plates are top performers that are guaranteed to keep your customers happy. Why Pros Choose Buff and Shine BUF Our re engineered high quality backing plates for high speed buffing were developed with our 20 years of past expertise in the field. These plates are top performers that are guaranteed to keep your